By closely inspecting the board, how can you tell that this RPi has more than 2 layers? How many layers do you think it has? 2. Match the following terms that are most likely shown within the circled areas shown in red on the PCB

Learning Goal: I’m working on a electrical engineering multi-part question and need an explanation and answer to help me learn.

answer 8 question belong to Raspberry pi PCB

1. By closely inspecting the board, how can you tell that this RPi has more than 2 layers? How many layers do you think it has? 2. Match the following terms that are most likely shown within the circled areas shown in red on the PCB (A‐G):

o Via Stitching

o Via Shielding

o Parallel bus lines

o Ground plane/copper pour

o Differential pair length matching o Serpentine Routing

3. Explain what each of the above concepts mean and what they would be potentially used for on the board? Include any sources you used in your search. Do not simply copy/paste material from websites and use your own words from reliable sources to explain.

4. What additional features of the board such as its components or design strike you as interesting and that you may not be familiar with based on knowledge you learned from the class this semester?

5. Why are the interfaces such as headers, USB/HDMI connectors, etc. located on only the periphery of the board?

6. Why is the MicroSD card located close to the Broadcom SOC (system‐on‐a‐chip) processor?

7. Identify as many features/components of the board as you can based on knowledge gained throughout the semester. You may mark and label them on the existing photo or take a new photo of the board you may already have.

8. Do you think this board could have been made smaller? What would be potential tradeoffs involved during the process of trying to design a smaller board?

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